Deployments of press-fit pinhole interconnects have demonstrated higher reliability than similar designs using conventional solder joint connections. This confirms the extensive test data accumulated in both laboratory and production environments, which show the overall higher quality and reliability of the press-fit technique compared to solder-based methods.
With no metal filler, there are no voids or other defects, which greatly increases the yield of good interconnects.The solderless nature of Press-Fit technology also helps eliminate unnecessary heating of partially or fully filled assemblies, thus avoiding the risk of damage to the assembly and/or the risk of accidental partial reflow of other solder joints, which can be weakened by multiple heating cycles.
These key benefits have made press-fit technology the solution of choice for many new product designs. It has also led to an increasing number of product design upgrades that have transitioned from solder-based connections to press-fit technology.
Advantages
Eliminates risk of dry joints, cracking and other solder formation problems
Robust, solder-free, repeatable and highly reliable interfaces
Verifiable assembly technology with integrated force monitoring
Automated press-fit assembly process for consistent results
Direct contact interface with high normal force
Excellent electrical and thermal transfer characteristics
Ability to withstand coefficient of thermal expansion mismatch forces during thermal cycling
High current carrying capacity for power applications
Applications
Press-Fit interconnect components address a wide range of applications such as PCB-to-PCB stacking interconnects, fuse holders, molded modules, smart junction boxes, controllers, lighting and a variety of other custom applications.
In particular, the explosive growth of automotive, energy and other markets using inverter and converter based power modules has driven the need for Press-Fit technology to provide reliable, solderless interconnect solutions that can support high current levels.
Today's Press-Fit interconnects have been tested and validated to support current capacities of 30A or more with a single Press-Fit eye, with reliable, predictable current-carrying performance profiles over the temperature range of 125ºC to 150ºC and above.
The combination of high current capacity, high reliability, and multiple configuration options make Press-Fit the leading interconnect design choice for power supply applications. Eliminating the hassles associated with soldering while improving reliability, performance, and reducing production costs are all good reasons to use Press-Fit technology.
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